2012 Scholarship for International Students for PhD and Master’s Studies at Pavement Engineering Laboratory, Sejong University
Informasi Kuliah Indonesia biaya-kuliah.net menyampai informasi tentang 2012 Scholarship for International Students for PhD and Master’s Studies at Pavement Engineering Laboratory, Sejong University sebagai berikut:
Scholarship Description: Scholarships are available for research programs in pavement engineering leading to Ph.D. (3.5~4 years), M.S. + Ph.D. (4.5 years combined course) and M.S. (2 years). The programs are research based and require publishing of research results in top academic journals. Selected candidates will be involved in government funded research projects. Candidates will receive full tuition fee waiver and salary (Approx. $900~1000 per month for PhD study; $600 per month for Master’s Program). Sejong University is one of the leading private universities in Korea.
Eligibility Bachelor’s and Master’s degree holding candidates with strong academic background from civil/ material engineering are encouraged to apply. Related work experience will be advantageous. University requires scores from one of the English proficiency tests (IELTS – 5.5; TOEFL (IBT) – 80). Study Subject(s): Civil/Transportation(Pavement) engineering Course Level: PhD and Masters Scholarship Provider: Sejong University Scholarship can be taken at: South Korea Scholarship Application Deadline: November 18, 2011 for 2012 Spring semester
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Scholarship Description: Scholarships are available for research programs in pavement engineering leading to Ph.D. (3.5~4 years), M.S. + Ph.D. (4.5 years combined course) and M.S. (2 years). The programs are research based and require publishing of research results in top academic journals. Selected candidates will be involved in government funded research projects. Candidates will receive full tuition fee waiver and salary (Approx. $900~1000 per month for PhD study; $600 per month for Master’s Program). Sejong University is one of the leading private universities in Korea.